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| CYStech Electronics Corp. General Purpose PNP Epitaxial Planar Transistor Spec. No. : C306A3-S Issued Date : 2005.09.29 Revised Date : Page No. : 1 / 5 BTA608A3 Features * The BTA608A3 is designed for use in driver stage of AF amplifier and general purpose amplification. * High HFE and excellent linearity * Large current capability and wide SOA * Complementary to BTC536A3 * Pb-free package Symbol BTA608A3 Outline TO-92 BBase CCollector EEmitter ECB Absolute Maximum Ratings (Ta=25C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP Pd RJA Tj Tstg Limits -60 -50 -6 -150 -400 500 250 150 -55~+150 Unit V V V mA mA mW C/W C C BTA608A3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25C) Symbol BVCEO BVCBO BVEBO ICBO IEBO *VCE(sat) VBE(sat) hFE 1 hFE 2 fT Cob Min. -50 -60 -6 160 70 Typ. 200 4.5 Max. -0.1 -0.1 -0.3 -1.0 560 Unit V V V A A V V MHz pF Spec. No. : C306A3-S Issued Date : 2005.09.29 Revised Date : Page No. : 2 / 5 Test Conditions IC=-1mA IC=-10A IE=-10A VCB=-40V VEB=-5V IC=-100mA, IB=-10mA IC=-100mA, IB=-10mA VCE=-6V, IC=-1mA VCE=-6V, IC=-0.1mA VCE=-6V, IC=-10mA VCB=-6V, f=1MHz *Pulse Test: Pulse Width 380s, Duty Cycle2% Classification Of hFE 1 Rank Range F 160~320 G 280~560 BTA608A3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current 1000 HFE@VCE=6V Spec. No. : C306A3-S Issued Date : 2005.09.29 Revised Date : Page No. : 3 / 5 Saturation Voltage vs Collector Current 1000 Saturation Voltage---(mV) Current Gain---HFE VCE(SAT)@IC=10IB 100 100 10 0.1 1 10 100 1000 Collector Current---IC(mA) 10 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage vs Collector Current 10000 VBE(SAT)@IC=10IB Cutoff Frequency vs Collector Current 1 Cutoff Frequency---FT(GHZ) Saturation Voltage---(mV) 1000 FT@VCE=12V 100 0.1 1 10 100 Collector Current---IC(mA) 1000 0.1 1 10 Collector Current---IC(mA) 100 Power Derating Curve 600 Power Dissipation---PD(mW) 500 400 300 200 100 0 0 50 100 150 Ambient Temperature --- Ta( ) 200 BTA608A3 CYStek Product Specification CYStech Electronics Corp. TO-92 Taping Outline Spec. No. : C306A3-S Issued Date : 2005.09.29 Revised Date : Page No. : 4 / 5 H2 H2 H2A H2A A D2 H3 L H4 H L1 H1 F1F2 D1 D W1 W T2 T T1 P1 P P2 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 BTA608A3 Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. TO-92 Dimension Spec. No. : C306A3-S Issued Date : 2005.09.29 Revised Date : Page No. : 5 / 5 A B 1 2 3 2 Marking: A608 3 C D H I E F G 1 Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA608A3 CYStek Product Specification |
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